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Title : SMIC Avezzano Fab Adopts DBI Stacking Process
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SMIC Avezzano Fab Adopts DBI Stacking Process

BusinessWire, PRNewswire: SMIC and Invensas, a subsidiary of Xperi, announce the establishment of Invensas’ Direct Bond Interconnect (DBI) at SMIC’s Avezzano facility (former LFoundry).

“Invensas’ DBI technology enables SMIC to manufacture the high performance image sensors required in mobile, automotive, and consumer electronics applications,” said Sunny Hui, SVP of marketing at SMIC. “With this technology in place, SMIC is prepared to further expand this capability into volume manufacturing around the globe, both at 200mm and 300mm.”

“SMIC’s talented manufacturing team has done an excellent job integrating our DBI process into their high-volume manufacturing environment,” said Craig Mitchell, president of Invensas. “We are thrilled to announce that SMIC is ready to engage commercial customers and support the demand for high volume production of BSI image sensors with DBI.”

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