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Title : Teledyne Announces Readiness of Wafer Level Packaged IR Sensors
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Teledyne Announces Readiness of Wafer Level Packaged IR Sensors

BusinessWire: Teledyne DALSA completed the qual of a its Wafer-Level-Packaged Vanadium Oxide (VOx) Microbolometer process for LWIR imaging.

Teledyne DALSA’s manufacturing process, located in its MEMS foundry in Bromont, Quebec, bonds two 200 mm wafers precisely and under high vacuum, forming an extremely compact 3D stack. This technology eliminates the need for conventional chip packaging - which can account for 75% or more of the overall device cost.

“This is an important milestone in our journey to bring a credible price/performance VOx solution to market,” said Robert Mehrabian, Chairman, President and CEO of Teledyne. “With the qualification process complete we will now begin ramping up production lines for a 17-micron pixel 320×240 (QVGA) device, closely followed by a 17-micron 640×480 (VGA), with longer-term plans to introduce a highly compact 12-micron detector family.”

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