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Title : Prophesee Introduces Event-Based Sensor in Industry-Standard, Cost-Efficient Package
link : Prophesee Introduces Event-Based Sensor in Industry-Standard, Cost-Efficient Package

Prophesee Introduces Event-Based Sensor in Industry-Standard, Cost-Efficient Package

PRNewswire: - Prophesee introduces what it calls the first industry-standard packaged chip with Event-Based Vision technology, a significant advancement over traditional frame-based vision approaches.

Under development for five years and commercially tested, this third-generation version is a VGA sensor with 15 μm pixels in a 3/4" optical format. It is aimed at developers of cameras in industrial automation and IoT systems such as robots, inspection equipment, monitoring and surveillance devices. It leverages Prophesee's neuromorphic vision technology to offer efficient capabilities for a variety of use models, including ultra high-speed part counting, vibration measurement and monitoring or kinematic monitoring for predictive maintenance.

"This is a major milestone for Prophesee and underscores the progress in commercializing our pioneering Event-Based Vision sensing technology. After several years of testing and prototyping, we can now offer product developers an off-the-shelf means to take advantage of the benefits of our machine vision inventions that move the industry out of the traditional frame-based paradigm for image capture," said Luca Verre, co-founder and CEO of Prophesee.

In Prophesee Metavision sensor, each pixel is independent and asynchronous, only activating if it senses a change in the scene, a movement - an event. This proprietary Event-Based approach allows for major reductions of power, latency and data processing requirements imposed by traditional frame-based systems. It enables sensors to achieve much higher DR than commonly associated with high-speed vision. And it allows cost-efficient sensors and systems to record events that would otherwise require conventional cameras to run at 10,000 fps.

The chip is packaged in a 13x15 mm mini PBGA package and is manufactured in a 0.18um CIS process. The packaging was realized by Kingpak.

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