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Title : OmniVision Unveils 8.3MP Automotive Sensors With LED Flicker Mitigation and 140dB HDR
link : OmniVision Unveils 8.3MP Automotive Sensors With LED Flicker Mitigation and 140dB HDR

OmniVision Unveils 8.3MP Automotive Sensors With LED Flicker Mitigation and 140dB HDR

PRNewswire: OmniVision announced the first two members of its new automotive sensor platform—the 8MP, front-view OX08A and OX08B. The high-resolution OX08A features HDR, while the pinout-compatible OX08B adds a LED flicker mitigation (LFM), enabled by the sensor’s on-chip HALE (HDR and LFM engine) combination algorithm. The new platform also integrates ASIL-C features.

“These new image sensors utilize OmniVision’s dual conversion gain (DCG) technology to achieve 82dB dynamic range on the first exposure, whereas competitors’ image sensors only provide a dynamic range of 60dB or less. Unlike DCG, the competing method, known as staggered HDR, relies on additional passes that introduce motion artifacts and diminish range, especially in low light,” said Celine Baron, staff automotive product marketing manager at OmniVision. “Additionally, OmniVision’s 3D stacking technology allowed us to integrate our unique HALE algorithm into the OX08B. The result is that this sensor platform provides an industry-leading 140dB HDR, along with the best LFM performance and high 8MP resolution for superior front-view captures, regardless of external lighting conditions.”

The new 1/1.8” optical format sensors have a 2.1um pixel with its 4-cell LFM technology in PureCel Plus-S stacked architecture. The OX08A and OX08B image sensors are both planned to be AEC-Q100 Grade 2 certified.

“Yole Développement’s recent technology and market research ‘Imaging for Automotive 2019’ confirms the accelerated market pull for viewing and ADAS applications at a 13.7% CAGR between 2018 and 2024,” asserted Pierre Cambou, principal analyst at Yole. “OmniVision’s new automotive CIS platform includes key features such as HDR and LFM, and is enabled by a stacked semiconductor approach. Introducing such exciting technology to its automotive lineup allows for on-chip integration that reduces BOM costs while providing a high level of performance and features in a very compact package, indeed much in sync with current market expectations.”

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