Title : Few More iPad LiDAR Pictures
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Few More iPad LiDAR Pictures
SystemPlus Consulting publishes Apple iPAD Pro 2020 LiDAR module reverse engineering report with few more pictures in addition to many that have already been published:"This rear 3D sensing module is using the first ever consumer direct Time-of-Flight (dToF) CMOS Image Sensor (CIS) product with in-pixel connection.
The 3D sensing module includes a new generation of Near Infrared (NIR) CIS from Sony with a Single Photon Avalanche Diode (SPAD) array. The sensor features 10 µm long pixels and a resolution of 30 kilopixels. The in-pixel connection is realized between the NIR CIS and the logic wafer using hybrid Direct Bonding Interconnect technology, which is the first time Sony has used 3D stacking for its ToF sensors.
The LiDAR uses a vertical cavity surface emitting laser (VCSEL) coming from Lumentum. The laser is designed to have multiple electrodes connected separately to the emitter array. A new design with mesa contact is used to enhance wafer probe testing.
A wafer level chip scale packaging (WLCSP), five-side molded driver integrated circuit from Texas Instruments generates the pulse and drives the VCSEL power and beam shape. Finally, a new Diffractive Optical Element (DOE) from Himax is assembled on top of the VCSEL to generate a dot pattern."
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