Title : IISW 2021 Annouces the Second Invited Presentation
link : IISW 2021 Annouces the Second Invited Presentation
IISW 2021 Annouces the Second Invited Presentation
The second invited paper at the International Image Sensor Workshop to be held on-line in September 2021 is devoted to modern EUV photolithography and presented by Wim Van der Zande from ASML. A quote from the abstract:"The present generation of ASML machines use EUV, or Extreme Ultraviolet “light”, which is not only absorbed by air, but also when it contacts materials like glass. Therefore it is not possible to use lenses or transparent reticles, which the previous method of photolithography did. The solution to these problems is the use of mirrors and reflective reticles and operate the process in a controlled vacuum. The EUV photons no longer come in contact with air and no longer need to pass through a lens. Reflective reticles are used to replace the traditional reticle.
In order to ensure a fully working chip, accuracy is very important. The accuracy of an ASML machine is measured in nanometers and is called overlay. Beard hair grows up to 10 nanometers per second. In my contribution, I concentrate on the present high volume manufacturing tools operating at EUV wavelengths and will explain the translation of the specifications needed to produce modern chips into the creation of sufficient EUV light, the required quality of the reflective optics and touch on the mechanical requirements of the fast moving reticles and wafers in our tools. Finally, I will make a link to imaging techniques that can be found in our tools as part of performance and operational metrology.
Wim van der Zande, Director of Research, D&E Source Laser"
In order to ensure a fully working chip, accuracy is very important. The accuracy of an ASML machine is measured in nanometers and is called overlay. Beard hair grows up to 10 nanometers per second. In my contribution, I concentrate on the present high volume manufacturing tools operating at EUV wavelengths and will explain the translation of the specifications needed to produce modern chips into the creation of sufficient EUV light, the required quality of the reflective optics and touch on the mechanical requirements of the fast moving reticles and wafers in our tools. Finally, I will make a link to imaging techniques that can be found in our tools as part of performance and operational metrology.
Wim van der Zande, Director of Research, D&E Source Laser"
The first IISW 2021 invited paper has been announced earlier.
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