Title : dpiX Develops Flexible X-Ray Sensors
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dpiX Develops Flexible X-Ray Sensors
dpiX announces its continued cooperation with the U.S.DoD in the next-stage development and production of polyimide-based, flexible optical sensor technologies that will support DoD explosive ordnance disposal applications. This milestone marks the final steps of this flexible X-ray project buy-plan that was competitively awarded to dpiX in 2017.dpiX operates the largest and most sophisticated flat panel semiconductor plant outside of Asia, and is said to be the worldwide market leader in optical sensors for radiography (a-Si/IGZO). dpiX strives to be the number one partner for U.S. technology companies to design, prototype and manufacture all kinds of flat panel semiconductors in its trusted U.S. semiconductor facility in Colorado Springs, Colo. dpiX and its strategic partners are currently pursuing support under the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act (as incorporated under the Biden administration’s infrastructure plan) to strengthen the U.S. flat panel foundry business.
“We are working in close technology cooperation with dpiX that will bring their new state-of-the-art flexible optical sensor technology within reach of our U.S. Armed Forces. Having an established and trusted manufacturing partner for this in the U.S. is of utmost importance in becoming less dependent on foreign value-chains,” said Keith DeVries, Program Manager, Manufacturing Science and Technology.
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